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and microwave-engineering background is a plus Proven ability to analyze and design mm-wave passive structures (e.g. transmission lines, distribution networks, radiating apertures, antenna-arrays
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, packaging & co-packaged optics Design of low loss passive components (Si, SiN, …) for scalable photonic systems Development of chip-to‑chip and chip‑to‑fiber coupling structures Technology pathfinding for co
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photonics and/or RF integration is a significant advantage. You enjoy leading a team with strong technical knowledge, clear goals, and structured work planning. You are a communicative people manager, able
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