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Field
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machine learning. A special emphasis will be placed on the correlative combination of the experimental capabilities of scanning electron microscopy (SEM), electron probe micro analysis (EPMA), transmission
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in COFs and their composites’ characterisation by SEM, FTIR, N2 physisorption (BET), TGA, XRD, SAXS. Experience in liquid-solid adsorption characterisation, particularly in water matrix, kinetics
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waste, using methodologies such as hydrothermal/solvothermal synthesis, controlled pyrolysis, or chemical carbonization. Knowledge of structural and morphological characterization techniques (SEM/TEM, XRD
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inorganic nanomaterials (XRD, UV-Vis, XPS, TEM/SEM, BET, TGA, FTIR, Raman) • Practical skills: inorganic synthesis and/or catalytic evaluation • Basic knowledge of quantum physics, fluid mechanics and
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characterization tools such as VSM, SQUID magnetometer, SEM, XRD, XRF, TGA, DSC, etc. Department Unit/Website: www.ameslab.gov Proposed Start Date: June 1, 2026 Proposed End Date or Length of Term: May 31, 2027
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using microscopy and materials characterization tools (e.g., SEM, AFM, TEM, thermal analysis). Maintain rigorous experimental records and contribute high-quality datasets for internal collaboration
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measurements during the build process. Material characterization includes SEM and TEM methods, lab and synchrotron X-ray diffraction, DSC, dilatometry, synchrotron X-ray and neutron residual stress measurements
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competency in electron microscopy (SEM, EBSD and TEM) Essential Application Experience in non-destructive evaluation and mechanical testing methods Desirable Interview Ability to plan, organise and execute
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characterization (e.g., XRD, SEM/EDX, transport measurements) Modeling and simulation of thermoelectric devices (e.g., COMSOL, ANSYS) Microfabrication and evaluation of micro thermoelectric devices Your profile
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fabrication by sputtering (e.g., magnetron sputtering; thin-film deposition workflows). • Materials characterization methods (morphology, structure, composition), e.g., SEM/EDS, XRD, profilometry, IBA, etc