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alignment, interface quality, and scalable assembly concepts. Method development in advanced integration approaches such as micro-transfer printing (µTP), layer transfer concepts, and advanced packaging
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outlining your motivation for applying, your research interests, and how your background aligns with the position Curriculum vitae (CV) detailing your educational background, relevant technical skills
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submitted in English and uploaded in PDF format. Please include the following required documents: Cover letter outlining your motivation for applying, your research interests, and how your background aligns
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