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slide imaging analysis in computational pathology is essential. Applicants should have a solid publication record and demonstrated experience in computer vision or analysis of pathology images
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demonstrated experience in computer vision or analysis of pathology images. The appointees will participate in a multidisciplinary collaborative research project related to development of deep learning model
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-of-the-art techniques to assess the physicochemical properties of nanoparticles, ensuring their stability, drug release kinetics, encapsulation efficiency and electron microscopy imaging. Integrate innovative
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Ph.D. degree in Epidemiology, Biomedical Sciences, Computer Science, Data Science, or related disciplines. A proven track record in peer-reviewed publications and research experience in computer graphics
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advancing the use of computer vision, deep learning, and machine learning for analyzing medical imaging modalities such as CT, MRI, X-ray, and ultrasound. Research areas include image segmentation, detection
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multidisciplinary team specializing in medical imaging and algorithm development. Our work focuses on advancing the use of computer vision, deep learning, and machine learning for analyzing medical imaging modalities
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availability and satisfactory performance) Applicants should possess a PhD degree in Mechanical Engineering, Electronic Engineering, Automation, or a related field, along with a minimum of two years of relevant
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Careers site (https://jobs.hku.hk ) and upload an up-to-date C.V. They should also arrange 3 referees to send reference letters to Prof. Wang YAO by email (wangyao@hku.hk ) directly. Review of applications
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to Professor V.W.W. Yam (email: wwyam@hku.hk ). A highly competitive salary commensurate with qualifications and experience will be offered, in addition to annual leave and medical benefits. The University only
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temporary term contract, with the possibility of renewal subject to funding availability and satisfactory performance) Applicants should possess a PhD degree in Mechanical Engineering, Electronic Engineering