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of advanced telecommunications and quantum computing. Current photonic‑integration approaches face major technical and economic limitations: complex and expensive processes, low integration density, and
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: Developing an innovative growth process (CVD and/or sputtering) to synthesize ultra‑thin 2D films. Transferring these films onto appropriate substrates. Characterizing their electrical, mechanical, thermal
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25 Jan 2026 Job Information Organisation/Company Université de Sherbrooke Research Field Engineering » Process engineering Biological sciences » Biological engineering Technology » Materials
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