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in multiscale and multifidelity simulation techniques (ab initio methods at different fidelity, machine learning tight-binding, machine learning force fields, phase-field modeling, and/or kinetic monte
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to numerical methods for kinetic equations. Mathematical topics of interest include high-dimensional approximation, closure models, machine learning models, hybrid methods, structure preserving methods, and
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for radiation protection and develops many of the biokinetic and dosimetric models recommended by the International Commission on Radiological Protection (ICRP) and applied by U.S. federal agencies
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include data compression and reconstruction, data movement, data assimilation, surrogate model design, and machine learning algorithms. The position comes with a travel allowance and access to advanced
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national security, proliferation detection, and nuclear forensics applications. This position resides in the Collection Science and Engineering Group in the Material Characterization and Modeling Section
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Postdoctoral Research Associate- AI/ML Accelerated Theory Modeling & Simulation for Microelectronics
. Focus will largely be in developing and deploying such AI/ML algorithms, closely collaborating with theorists and experimentalists to realize physics- models and/or physics-aware ML-models that can bridge
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thermomechanics. Major Duties/Responsibilities: Help to develop and apply physics-based and/or machine learning models for advanced manufacturing processes. Author peer reviewed papers for journals and conference
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modeling techniques and make fundamental contributions to the field. Interact with other researchers, technicians, and students to shape and drive the research agenda. Present and report research results and
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develop cutting-edge differential privacy techniques for large-scale models across multiple institutions. This position offers a unique opportunity to work with the world's first exascale system
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strategic analysis and modeling research activities of advanced materials, supply chain, and advanced manufacturing technologies for various DOE program offices. The latest analyses focus on DOE’s Advanced