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Field
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the patented PowderMEMS technology. A core competence is the integration of porous microstructures on wafers for various microtechnological applications. Further information on the »Agglomerated Microsystems
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accounts for the observed microstructural effects, validated through comparison with available experimental data and implementable in finite element simulations for engineering applications. Where to apply
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innovation, and materials research capability expansion. This position resides in the Radiation Effects and Microstructural Analysis Group (REMAG) within the Materials in Extremes Section, Materials Science
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microstructure and mechanical properties and correlate these with the process route. You will conduct modelling investigation and validation of the performance (wear, resistance to fatigue cracking) under working
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fatigue under cyclic loading in pressurized high-temperature water environments, with links to microstructure and manufacturing processes. The work combines material modeling using crystal plasticity and
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on modelling nucleation and evolution of damage under monotonically increasing or static loading in pressurized high-temperature water environments, with links to microstructure and manufacturing processes
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for five-axis material processing with micrometer-scale precision down to 1 µm, enabling the fabrication of complex three-dimensional microstructures. The work combines high-precision, force-free laser
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metallurgical and microstructural characterization using optical and electron microscopy techniques. The position also involves regular interaction with industrial collaborators, as well as written and verbal
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technology. Responsibilities include literature review, experimental design, processing of EBCs, mechanical and thermal testing, and metallurgical and microstructural characterization using optical and
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, spectroscopic and microstructural techniques, to investigate mass transport of chloride and other key constituents of the cemented matrix containing Magnox metal, improving understanding of key parameters