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Davarzani (BRGM) and Dr. Sophie Sablé (La Rochelle University), as well as a German partner. The project will be conducted within the Molecular and Environmental Microbiology (MEM) team at the Bioscience and
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the oxidation state and the electric-polarization direction in HfO2. Project included in the activities of the MEM group of CEMES, funded by the labex NanoX. Where to apply Website https
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advance the development of in the broad areas of emerging memory materials and devices, including post silicon MOSFET-based computing such as analog in-memory-computing or 2D-material based FETs, MEMS
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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testing, and long-term stability evaluation. Develop vibration-based energy harvesting systems, including MEMS-based and macroscale variable-capacitor harvesters. Fabricate, characterize, and test electrode
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National Aeronautics and Space Administration (NASA) | Fields Landing, California | United States | 2 months ago
) coronagraph and a wavefront control system utilizing MEMS deformable mirrors. There are opportunities for participating in this effort in a variety of areas, including optical analysis and alignment, wavefront
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Duke University, Mechanical Engineering and Materials Science Position ID: Duke-MEMS-PDZHONG [#31728] Position Title: Position Type: Postdoctoral Position Location: Durham, North Carolina 27701
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, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro-static and Quasi-static simulations) Discrete electronic design (Analog and digital design using COTS
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 2 months ago
. Description: This opportunity involves research and development activities in the following technology areas: 1. Chip-scale stable laser systems using MEMS and nanophotonic technologies including but not
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nanofabrication of other types of Beyond-CMOS devices that can be combined with spintronics, such as those exploring MEMS and 2D materials; Capacity to follow and design a run-sheet for the nanofabrication