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Field
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demonstrated skills in the following areas: (i) Fabrication of 2D materials based nanodevices using exfoliation, transfer, optical and electrical beam lithography (EBL). Strong command of EBL is required. (ii
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, and Experience Experience with x-ray techniques and/or synchrotron experiments. Experience with nanofabrication tools (particularly focused ion beam and lithography). Background in condensed matter
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, Electrical Engineering, Applied Physics, or related field Hands-on cleanroom experience (stepper, e-beam lithography, dry/wet etching, thin-film deposition, bonding, micro-transfer printing) Experience with
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materials (sputtering, PLD, wet-chemistry approaches), lithography (optical, e-beam), magnetometry equipment (VSM, MOKE), electrochemistry (galvanostats), ferroelectric characterization of materials
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. Experience with phase retrieval algorithms, clean room use and e-beam lithography are beneficial. The candidate will be expected to participate at international user facilities and thus will be expected
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-beam lithography, UHV thin-film deposition, dry/wet etching, materials and surface metrologies) Experience operating dilution refrigerators Expertise in superconducting microwave circuit design and
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the fabrication of LED and laser diodes Demonstrated experience in the cleanroom fabrication of thin films by solution and vacuum processes- e-beam lithography, e-beam deposition, sputtering. A record of
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. Experience with TEM, including Lorentz TEM and in-situ cryo experiments. Experience with nanofabrication (e.g., focused ion beam, electron-beam lithography and photolithography), transport measurements and
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experimental background in nanophotonics and optoelectronics. Experience in micro- and nano-fabrication is required. Experience with laser interference lithography and/or electron-beam lithography desired
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the last 0-5 years) in the field of electrical engineering, experimental physics, materials science, and mechanical engineering, or related discipline Experience in electron beam lithography and/or micro