Microscale Mechanical Characterization of Heterogenous Structures in Advanced Packaging

NIST, United States

Updated: 1 day ago
Location: Gaithersburg, MARYLAND

RAP opportunity at National Institute of Standards and Technology     NIST

Microscale Mechanical Characterization of Heterogenous Structures in Advanced Packaging


Location

Material Measurement Laboratory, Materials Measurement Science Division


opportunity location
50.64.31.C1093 Gaithersburg, MD

NIST only participates in the February and August reviews.


Advisers
name email phone
Yvonne Beatrice Gerbig yvonne.gerbig@nist.gov 301 975 6130
Description

We are seeking a Postdoctoral Researcher to advance the mechanical reliability of next-generation semiconductor architectures. This postdoctoral position focuses on developing measurement methodologies to characterize mechanical properties and deformation behavior in advanced packaging applications. It involves:

  • Design, application, and evaluation of novel experimental setups and procedures for microscale mechanical testing at elevated temperatures
  • Collection, analysis, and dissemination of experimental data to determine advanced mechanical properties (e.g., interfacial adhesion, fracture strength) of heterogeneous structures

We are looking for researchers with a PhD in Mechanical Engineering, Materials Science, or Physics who have expertise in microscale mechanical testing (e.g., instrumented indentation, scratch testing, fracture toughness testing).


key words

Microscale Mechanical testing; indentation; scratch testing; fracture toughness; advanced packaging; Experimentation


Eligibility

citizenship

Open to U.S. citizens


level

Open to Postdoctoral applicants


Stipend
Base Stipend Travel Allotment Supplementation
$82,764.00 $3,000.00

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