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3 Apr 2026 Job Information Organisation/Company Università di Pisa - Centro di Ricerca Research Field Engineering Researcher Profile Recognised Researcher (R2) Leading Researcher (R4) First Stage Researcher (R1) Established Researcher (R3) Application Deadline 16 Apr 2026 - 13:00...
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://www.ctcms.nist.gov/oof/ . Opportunities exist in image analysis, materials science, physics, and computer science. key words Computation; Finite element modeling; Microstructures; Eligibility citizenship Open to U.S
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., J. Chem. Engr. Data., 2020, 65 (7) Multiphysics simulations; computational fluid dynamics; finite volume, finite and discrete element methods; computational fluid and particle dynamics; multiscale
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minimum of 5 years of experience Experience on computational mechanics, finite element simulations, isogeometric analysis, data-driven modeling and scientific machine learning. Experience with computational
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of their operating conditions make it challenging to predict component health under poorly represented or previously untested conditions. Modern prognostics approaches rely either on physics-based models or on data
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image correlation (DIC) datasets with fully three-dimensional finite element analysis (FEA) results in mechanical test setups on metals and polymers including uni-axial and bi-axial loading at different
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of the design using both finite element packages and mathematical tools. Oversee modelling work of others on the team in particular mentoring junior members of the team. The design and modelling work will include
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. The post holder will contribute to the development and validation of multi-scale finite-element analysis tools to predict the progressive damage evolution in composite materials, subject to a variety of
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. Emphasis is placed on model validation against both high-fidelity finite element simulations and experimental tests of structural subassemblies. key words Blast loading; Computational modeling; Finite
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. This postdoctoral position focuses on developing high-fidelity Finite Element Method (FEM) simulations to characterize mechanical properties and deformation behavior in advanced packaging applications. It involves