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highly complex workflows. We aim to develop optimization models and algorithms to improve wafer processing sequences across semiconductor manufacturing tools, with the objectives of reducing cycle times
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advancing the use of computer vision, deep learning, and machine learning for analyzing medical imaging modalities such as CT, MRI, X-ray, and ultrasound. Research areas include image segmentation, detection
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14 Feb 2026 Job Information Organisation/Company THE UNIVERSITY OF HONG KONG Research Field Biological sciences Computer science Researcher Profile Recognised Researcher (R2) First Stage Researcher
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