-
, including both chip-to-wafer (C2W) and chip-to-chip (C2C) approaches. Core technical directions Heterogeneous integration of wide-bandgap (WBG) electronic components (e.g., GaN/SiC and related platforms
-
. Please note that interviews will not be conducted. For more information, please go first to Frequently Asked Questions We offer We offer a research-inspiring work environment with an excellent up-to-date
-
). Shortlisted applications will be sent to external evaluators for review. Please note that interviews will not be conducted. For more information, please go first to Frequently Asked Questions We offer We offer
Searches related to chip
Enter an email to receive alerts for chip positions