34 unconvensional-computing Postdoctoral positions at Stony Brook University in United States
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Electrical Engineering, Computer Science, Applied Mathematics, or a closely
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Electrical Engineering, Computer Science, Applied Mathematics, or a closely
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Job Description Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and Computer Engineering, Applied Mathematics or a
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(IRACDA) program . This comprehensive program offers 3 years of support to outstanding candidates seeking postdoctoral research training along with an opportunity to obtain mentored teaching experience in a
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Job Description Required Qualifications: (as evidenced by an attached resume) Ph.D. (or foreign equivalent) in Electrical Engineering, Computer Science, Applied Mathematics, or a closely related field
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Postdoctoral Associate- Artificial Intelligence Innovation Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and
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Postdoctoral Associate- Artificial Intelligence Innovation Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Science, Electrical and
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Associate will assist a Principal Investigator Leon Shterengas in the Department of Electrical and Computer Engineering . The incumbent will conduct research on semiconductor photonic device nanofabrication
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Associate will assist a Principal Investigator Leon Shterengas in the Department of Electrical and Computer Engineering . The incumbent will conduct research on semiconductor photonic device nanofabrication
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Computer Engineering or a closely related field, completed by the start date of the appointment. Research experience in at least one of the following areas: ● Chip design, tape-out, and testing