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PhD scholarship in Corrosion Mechanisms of Power Semiconductor Device and Components - DTU Construct
mechanisms in IGBT and SiC Power MOSFET devices by using test structures that mimic actual components as well as actual components under varied humidity, temperature, gaseous, and electrical potential
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energy to carry out research, development, and testing of novel solutions in the production of large structures, such as buildings, ships and offshore platforms. In this context, the candidate is expected
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composites circularity. The position will be anchored in Section of Composites Manufacturing and Testing. This section, together with the other sections in the division, comprises state-of-the-art experimental
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from programmes that evaluate thesis/examination project by approved/not approved: An official written assessment of the thesis or dissertation project from the grade giving institution. The statement
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scheme of the awarding universities (if not Danish). Only for applicants from programmes that evaluate thesis/examination project by approved/not approved: An official written assessment of the thesis
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development of implements for managing main and support crops in the field, tested on stationary gantry robots and mobile platforms. Work includes lightweight, structurally optimized mechanical design, sensor
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of retinal degeneration. Your work will contribute to developing new therapeutic and drug testing strategies for vision preservation. Responsibilities and qualifications We are looking for a creative and
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for the development, calibration and validation of the corresponding advanced multi-physics computational models. You will collaborate closely with a postdoctoral researcher responsible for in-situ fatigue testing
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Engineering and project teams to achieve high quality solutions. Documentation of assembly and test instructions. Skilled at communicating with other engineering teams and team members. Excellent data analysis
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with a postdoctoral researcher responsible for in-situ fatigue testing under corrosive environments, and will participate in the 4D (x,y,z,time) analysis of the AM microstructure and crack formation