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Combat Capabilities Development Command, Soldier Center (DEVCOM-SC) is offering an internship opportunity in the U.S. Army’s Food Additive Manufacturing (3D food printing) program. What will I be doing? As
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upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click here for detailed information about acceptable transcripts
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flight physics, communication and networking, and computational and information sciences. A complete application includes: Curriculum Vitae or Resume Three References Forms An email with a link to the
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(goals, experiences, and skills relevant to the opportunity) Resume (PDF) Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets
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, multifunctional technology, combustion processes, propulsion and flight physics, communication and networking, and computational and information sciences. A complete application includes: Curriculum Vitae or Resume
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minimum collateral damages. Applicants for the research category should possess a Ph.D. in applied math, computer science, physics, engineering or a related discipline. Research in the second category may
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, material science and technology, multifunctional technology, combustion processes, propulsion and flight physics, communication and networking, and computational and information sciences. About MECHANICAL
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technology, multifunctional technology, combustion processes, propulsion and flight physics, communication and networking, and computational and information sciences. About PHOTONICS, ELECTRONICS, & QUANTUM
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computer programming and/or computer science Completed coursework in chemistry, physics, and biology (Advanced Placement or Honors courses preferable) Application Requirements A complete application consists
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to the opportunity) Resume (PDF) Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click