16 computer-science-programming-languages-"U.S"-"U.S" positions at University of Zurich
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expertise? Through an Impact Collaboration Programme (ICP) project, you can develop creative ways to work together to ensure that the best available knowledge supports the design of solutions to the complex
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DIZH understands innovation very broadly and includes all disciplines: artistic, design, natural science, technology, humanities, education and social science.
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. The scholarship programme is currently open to applicants from 183 countries. What are Swiss Government Excellence Scholarships? Research scholarships These scholarships are available to postgraduate researchers in
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an associate professor (or above) under the age of 50 when applying for senior scholar programs - Have attained the level of Chinese proficiency (HSK) required by the target program . Please refer to
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they are setting up or consolidating their own research team or programme. The MSCA (Marie Skłodowska-Curie Actions) enable cross-border mobility and thus support researchers at all stages of their careers. Swiss
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care work, part-time employment, or career breaks and consider applications proposing joint research in job-sharing. With its early-career fellowship program, the Collegium nurtures an environment
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. The latest example is our joint funding of natural science and engineering projects together with Canada’s NSERC. Read more 09.12.2022 Scientific Exchanges: Broadening one's horizons, building new networks A
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the Study of Religion: 12 months Faculty of Law: 12 months Faculty of Business, Economics and Informatics: 12 months Faculty of Medicine: 12 months Vetsuisse Faculty: 12 months Faculty of Arts and
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. The nomination documents can be submitted in German or English and must be sent in one single PDF-file to support@research.uzh.ch . If you have any questions, please contact the Research & Grants Office: support
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of Sciences, National Academy of Engineering and Institute of Medicine of the National Academies, The National Academies Press 306, Washington, D.C., p. 188.