285 algorithm-development-"Multiple"-"Simons-Foundation"-"Prof"-"UCL" positions at University of Nottingham
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supported by academic experts within the University’s Department of Architecture and Built Environment , you will lead a strategic project to develop an AI-driven passive-hygrothermal solution that enhances
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opportunity for a chef who is passionate about fresh, quality food and looking to take the next step in their career. Prepare and serve consistent, high-quality meals for our resident students during term time
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chef who is passionate about fresh, quality food and looking to take the next step in their career. Prepare and serve consistent, high-quality meals for our resident students during term time Cater for a
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development through the provision of training, continued support, and career progression opportunities. Access to a range of benefits and rewards, including fitness and health facilities, staff discounts
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to staff development through the provision of training, continued support, and career progression opportunities. Access to a range of benefits and rewards, including fitness and health facilities, staff
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university closure days including closure between Christmas and New Year. Commitment to staff development through the provision of training, continued support, and career progression opportunities. Access to a
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or temperature. This project will develop the materials, methods, and designs necessary to 3D-print the next generation of electro-responsive soft-actuators. The overall aim is to develop and exploit new designs
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to produce anti-counterfeit markings, dye-free colour images, humidity and chemical sensors, anti-glare coatings and optical filters. This project will develop additive manufacturing of devices with actively
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ultrasound. This project will develop the materials, methods, and designs necessary to 3D-print the next generation of medical micro-robots targeting drug delivery, exploiting combinations of functions
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plan in heterogeneous integration-based activities regarding power semiconductor bonding, interconnect, packaging, thermal management and reliability, developing new concepts and ideas. Where