214 embedded-system "https:" "https:" "https:" "https:" "UCL" "UCL" positions at Technical University of Denmark
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of Denmark, is seeking candidate for a PhD position (3 years) to work on investigating transient build-up condensed water layer on electronics surfaces such as Printed Circuit Board Assembly and DBC Substrates
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. Neil Sinclair and Prof. Marko Lončar), where TFLN devices will be fabricated at DTU and TFLT at Harvard. Scientific Environment The project is funded by The Novo Nordisk Foundation and anchored at DTU
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material testing, catalyst characterization (BET, XRF, XRD, NH3-TPD, TEM), and performance evaluation. Hands-on experience with high-pressure reactor systems and process optimization. Proficiency in process
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Job Description Are you passionate about pushing the frontier of catalysis science? The Center for Visualizing Catalytic Processes (VISION) at the Technical University of Denmark (DTU) is offering
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Job Description A postdoctoral position is available in the Section of Experimental and Translational Immunology (xTI), Department of Health Technology (DTU Health Tech), at the Technical University
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is to develop RL methods that can search large policy spaces and support decision-makers in exploring robust strategies under deep uncertainty. Policy problems typically involve many control levers
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Job Description At CERE we are currently developing a world-leading research group in gas cleaning technologies. The scientific field of gas cleaning, especially carbon capture, is growing, and we
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on research. We place emphasis on a high level of professionalism among our staff, so skills development is an integral part of our organization. We offer a great flexibility in the position. In the area of
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DTU Skylab, from airborne windmills, farming snails, building new sustainable batteries, AI robots and digital services. It is a challenging job in a very dynamic environment. You will become a part of
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of Denmark, is seeking candidate for a PhD position to work on investigating transient build-up condensed water layer on electronics surfaces such as Printed Circuit Board Assembly and DBC Substrates and how