344 data-"https:"-"https:"-"https:"-"https:"-"https:"-"https:" positions at Hong Kong Polytechnic University
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to contact Miss Deng Jing via email at haungxaio.deng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is
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or via email at horace.mui@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will commence on 10 March
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Zhang at telephone number 2766 6162 or via email at yi-ee.zhang@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration
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) experience in programme and/or subject administration; (d) a good command of both written and spoken English and Chinese, preferably with fluency in Putonghua; (e) excellent computer literacy; (f
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Putonghua; and (f) high proficiency in computer applications, including MS Word, Excel and PowerPoint, with experience in the Oracle Financials (purchasing module)/e-tendering/supplier sourcing system
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projects on-time with minimum supervision. Preference will be given to those with research experience in machines design and development of computer programmes for numerical computation of electromagnetic
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): Medical Laboratory Science, Medical Imaging & Radiation Science, Medical Physics, and Medical Data Science. HTI cultivates future leaders with both professional expertise and scientific vision, fostering
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) solid mathematical background. Applicants are invited to contact Prof. Jinzhi Bu at telephone number 2766 7415 or via email at jinzhi.bu@polyu.edu.hk for further information. Conditions of Service A
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have: (a) experience in working with children and youth with special educational needs; (b) a good command of both written and spoken English and Chinese; (c) good computer literacy and
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information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 28 February 2026. Apply Now Posting date: 9 February 2026