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computational fluid dynamics (CFD), cardiovascular modeling, or biomechanical growth and remodeling. Demonstrated experience with numerical methods (e.g., finite element method), programming languages (C
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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro-static and Quasi-static simulations) Discrete electronic design (Analog and digital design using COTS
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by working to develop novel algorithms on finite element method, isogeometric analysis, geometric modeling, machine learning and digital twins to study various applications such as computational