2 postdoc-parallel-computing PhD positions at Université de Sherbrooke

PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

- 02:00 (America/Toronto) Type of Contract Temporary Job Status Full-time Hours Per Week 37 Offer Starting Date 1 Sep 2025 Is the job funded through the EU Research Framework Programme? Other EU

PhD Offer-Development of molding processes for heterogeneous integration of large electronic chips

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

Research Framework Programme? Other EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Context: Advanced packaging technologies are crucial