1 finite-element-analysis PhD positions at Université de Sherbrooke

PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

to high temperature, which may cause defects of crack, delamination and even failure of the component. Therefore, we propose this thesis project to develop a novel embedded cooling solution to efficiently extract heat