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. Collaborating closely with component experts, we innovate at the system level to advance these technologies and bridge the gap between research and industry. Each system integrates a novel microchip or sensor
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that develops advanced AI compute solutions involving AI models, algorithms, implementations, sensors and hardware for small scale edge up to large scale distributed and hybrid hardware architectures
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, you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will
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