11 machine-learning-"https:" "https:" "https:" "https:" "https:" "https:" "The Institute for Data" Master scholarships at DAAD
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19 Dongfang Donglu, Chaoyang District 100600 Beijing, VR China Tel.: +86 010/6590 6656 Fax.: +86 (10)/6590-6393 E-Mail: postmaster@daad.org.cn WWW: https://www.daad.org.cn/zh Please note Your
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Mexican and German scientists and academics. Further information Comecyt - Consejo Mexiquense de Ciencia y Tecnologí¬a Website: https://g.co/kgs/sSYfhBy Email: becainternacional@edomex.gob.mx
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into consideration. Please submit your complete application by sending it to secai-office@tu-dresden.de , preferably via the TU Dresden SecureMail Portal https://securemail.tu-dresden.de . Application Deadline
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for the admission process. Please inform yourself in plenty of time about the application process at the host institution. Further information For detailed information please see the Call for Scholarship Applications .
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Province (BPSDM Aceh) Jl. T. Panglima Nyak Makam No. 8 Banda Aceh INDONESIA Tel.: +62-651-7552564 https://bpsdm.acehprov.go.id/
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their Bachelor’s degrees with very good grade point averages. They have furthermore been admitted to one of the following Master’s degree programmes at RWTH International Academy: MSc Computer Aided Conception and
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months doctoral theses: 1,850 EUR per month over 2 years with an option to renew the sponsorship Additional applications can be filed to acquire specialist literature and to attend scientific conferences
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own deadline for the admission process. Please inform yourself in plenty of time about the application process at the host institution. Further information For detailed information please see the
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the institution. The institution sets its own deadline for the admission process. Please inform yourself in plenty of time about the application process at the host institution. Further information For detailed
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study programme. Suitable proof of necessary language skills - or the ability to acquire them through the German language course - must be submitted with the application documents. Find more information