172 data-"https:" "https:" "https:" "https:" "https:" "https:" "KU LEUVEN" research jobs at Hong Kong Polytechnic University
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or via email at horace.mui@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will commence on 10 March
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) assist in data collection using ArcGIS Survey123, including training SDU residents on questionnaire usage and tagging points of interest (POIs); (b) conduct spatial analysis and visualisation using
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to contact Miss Deng Jing via email at haungxaio.deng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is
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projects on-time with minimum supervision. Preference will be given to those with research experience in machines design and development of computer programmes for numerical computation of electromagnetic
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Zhang at telephone number 2766 6162 or via email at yi-ee.zhang@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration
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at telephone number 3400 8571 or via email at shea.ping.yip@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications
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information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 28 February 2026. Apply Now Posting date: 9 February 2026
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) solid mathematical background. Applicants are invited to contact Prof. Jinzhi Bu at telephone number 2766 7415 or via email at jinzhi.bu@polyu.edu.hk for further information. Conditions of Service A
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experience at the time of application. Applicants are invited to contact Prof. Qing Li at telephone number 2766 7252 or via email at qing-prof.li@polyu.edu.hk for further information. Conditions of Service A
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kam.kh.ng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 23 February 2026. Apply Now Posting date