185 embedded-system "https:" "https:" "https:" "https:" "St" "St" research jobs at Hong Kong Polytechnic University
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highly competitive remuneration package will be offered. The closing date for application is 31 March 2026. Apply Now Posting date: 24 March 2026
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information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 31 March 2026. Apply Now Posting date: 24 March 2026
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remuneration package will be offered. The closing date for application is 8 April 2026. Apply Now Posting date: 24 March 2026
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Department of Industrial and Systems Engineering Research Assistant (Full-time/Part-time) (three posts) (Ref. 260108002) [Appointment period: each for twelve months] Duties The appointees will
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. The closing date for application is 9 June 2026. Apply Now Posting date: 17 March 2026
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competitive remuneration package will be offered. The closing date for application is 4 May 2026. Apply Now Posting date: 18 March 2026
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assistant: An AI system for flipped classroom”. Qualifications Applicants should have: (a) an honours degree or an equivalent qualification; (b) passion for HCI/e-learning research; and (c
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remuneration package will be offered. The closing date for application is 31 March 2026. Apply Now Posting date: 27 February 2026
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Department of Industrial and Systems Engineering Postdoctoral Fellow / Research Associate / Research Assistant (Full-time/Part-time) (several posts) (Ref. 260310003) [Appointment period: each for
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construction safety inspection for smart cities enabled by the low altitude economy”. Qualifications Applicants for the Postdoctoral Fellow post should have a doctoral degree or an equivalent qualification and