25 computer-programmer-"https:"-"Prof" "https:" "https:" "https:" "https:" "U.S" Postdoctoral positions in Switzerland
Sort by
Refine Your Search
-
Listed
-
Employer
-
Field
-
) Application Deadline 26 Apr 2026 - 21:59 (UTC) Country Switzerland Type of Contract Temporary Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is
-
, listed until 2026/09/02 04:59 AM UnitedKingdomTime) Position Description: Apply Position Description Postdoctoral Positions in Theoretical Quantum Matter and Quantum Information Science Swiss Federal
-
Framework Programme? Horizon Europe Is the Job related to staff position within a Research Infrastructure? No Offer Description Materials science and technology are our passion. With our cutting-edge research
-
Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Postdoc Position in Glioblastoma Neurobiology and Neuron
-
apply at https://careers.epfl.ch/job/Lausanne-Postdoctoral-Position-in-Stochastic-Analysis/1163749755/ . Contact: Bernadette Brun, + 41 21 693 9051 Email: Postal Mail: EPFL SB MATH STOAN MA C2 647
-
Researcher (R2) Application Deadline 18 Apr 2026 - 21:59 (UTC) Country Switzerland Type of Contract Temporary Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a
-
Start date: September 2026 (flexible) Duration: 3 years (36 months) Project The High Performance Computing (HPC) research group (Prof. Florina M. Ciorba), Department of Mathematics and Computer
-
received by 1 November 2025. Note: as an option, one of the four reference letters can be about teaching. For more details, please see the website: https://math.ethz.ch/fim/postdocs.html Application
-
patient treatment. We (boecklab.com) are looking for a scientist who will define the computational backbone of this programme.
-
of the work requires a very high level of experimental skills. You need to program the hybrid printer and possibly modify the device to be able achieve more freedom in printing and milling of the 3D printed SiC