Sort by
Refine Your Search
-
areas of nanoscience and nanotechnology. Job Title: Reliability Engineer - ASIC-Integrated Thin-Film Devices Department: Advanced Electronic Materials and Devices Description of Group/Project
-
Processing (punctuation: 25) Item 03: Experience in: RF design for satellite comm, FPGA programming in VHDL., PCB design for RF (punctuation: 25) Item 04: Personal Interview. The interview will be conducted
-
LevelUndergraduate Skills/Qualifications Microcontroladores, Microprocesadores, FPGAs LanguagesENGLISHLevelExcellent LanguagesFRENCHLevelGood Additional Information Eligibility criteria https://www.upm.es
-
member of the Medipix Collaboration, the group has access to the full family of Medipix ASICs. In addition, the Medical Physics group benefits from access to state-of-the-art packaging facilities, which
-
position focused on the development of low-power SiPM-based radiation detectors for space missions. The selected candidate will be involved in the data analysis for the quality control of ASICs developed
-
-signal circuits. - Valuable Knowledge of comercial design tools like Cadence / Synopsys. - Competence in computer architectures and digital system design with HDLs (Verilog or VHDL). - Knowledge
-
-voltage laboratory instrumentation, or high-energy detector instrumentation. Experience in at least one of the following areas: FPGA-based digital signal acquisition systems, digital signal processing
-
circuit design, with independent capabilities in structure, hardware schematic, and PCB design; familiar with embedded development on ARM Cortex-M/A series, DSP, or FPGA, as well as the principles and