184 data-"https:"-"https:"-"https:"-"https:"-"https:"-"https:"-"Dr" positions in Hong Kong
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- “Deep learning-based approach for process parameter optimization of SiC wafer under limited data”. He/She will carry out research in the area of machine learning (ML) and data science, and also be
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interpersonal and communication skills. Applicants are invited to contact Prof. Richard Li via email at richard-chen.li@polyu.edu.hk for further information. Conditions of Service A highly competitive
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information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 12 February 2026. Apply Now Posting date: 18 December 2025
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or via email at liang.an@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 30 June 2026. Apply Now
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our research team at HKU working at the forefront of ocean remote sensing and global change monitoring. Our work combines satellite data, physical models, and AI methods to understand ocean dynamics and
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and energy materials. Preference will be given to those with knowledge of computer programming, AI and/or machining learning. Applicants are invited to contact Prof. Jianguo Lin at telephone number 2766
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information. Conditions of Service For full-time appointments, a highly competitive remuneration package will be offered. For part-time appointments, the remuneration rates are HK$385 per hour for the post of
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number 2766 4201 or via email at annabella.suen@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will
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4596 or via email at ming.li@polyu.edu.hk for further information. Conditions of Service For full-time appointment, a highly competitive remuneration package will be offered. For part-time appointment
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at telephone number 2766 7135 or via email at shu-ping.li@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application