29 high-performance-quantum-computing-"https:"-"https:"-"https:"-"https:"-"https:" Fellowship positions in Hong Kong
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the challenge in Computational Social Science and FinTech; (b) perform data collection and processing for the identified challenge issues; (c) conduct data analysis and design a framework for the identified
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development of Unmanned Aerial Vehicle (UAV) and robotics; and (d) experience in conducting research or project administration. Preference will be given to those with experience in handling high-impact
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focus on combustion, detonation or fluid dynamics; (c) research experience in computational fluid dynamics (CFD); (d) experience in experimental and/or numerical methods for studying detonation
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performance analysis and design of AI in the loop for autonomous vehicles (AVs) at the time of application. Applicants are invited to contact Ms Icarus Lam at telephone number 3400 2469 or via email at icarus
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the research project - “AI-driven academic and emotional support for capstone success”. He/She will be required to: (a) prepare research reports to be published in high-quality papers in top-pier education
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project - “Establishment of joint research centre on brain-inspired computing”. He/She will be required to: (a) conduct the research on the development of neuromorphic foundation models and brain
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) carry out research work; (b) conduct research activities in the industry; and (c) perform any other duties as assigned by the project leader, Dean of School or their delegates. Qualifications
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the research project - “Advancing generative AI algorithms for haptic rendering: bridging human-computer and human-robot interactions”. Qualifications Applicants should have a doctoral degree or an equivalent
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and energy materials. Preference will be given to those with knowledge of computer programming, AI and/or machining learning. Applicants are invited to contact Prof. Jianguo Lin at telephone number 2766
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Applicants should have a doctoral degree or an equivalent qualification in Biomedical Science, Bioengineering, Biomedical Engineering, Electronic Engineering, Computing, Materials Science, or related areas and