86 data-"https:"-"https:"-"https:"-"https:"-"INESC-TEC" Fellowship positions at Hong Kong Polytechnic University in Hong Kong
Sort by
Refine Your Search
-
experience. They should also have a strong publication record in laboratory-based research and clinical data analysis. Applicants are invited to contact Prof. Chien-Ling Huang at telephone number 3400 8602
-
for the Senior Research Fellow post should have a PhD degree in Computer Science, Artificial Intelligence, Data Science, Digital Economy or a related field plus at least six years of postdoctoral research
-
interactive art installations”. They will be required to: (a) assist in literature review; (b) develop the system; (c) assist in user studies (e.g. experiment design, data collection and analysis
-
assist the project leader in the research project – “Smart Holistic Insurance Enhancement using Learning Algorithms & Dialog Data (S.H.I.E.L.D.)”. They will be required to: (a) develop machine learning
-
Department of Data Science and Artificial Intelligence Research Fellow / Research Associate / Research Assistant (Full-time / Part-time) (Ref. 260319012) (1) Research Fellow (Full-time / Part
-
involving non-musicians to explore causal relationships; (c) collect, analyse, and manage project data; (d) compile reports and papers for internal and external consumption, and disseminate research
-
experience or equivalent qualifications and experience. Applicants are invited to contact Prof. Yang Tong at telephone number 2766 6922 or via email t.yang@polyu.edu.hk for further information. Conditions of
-
months] Duties The appointees will assist the project leader in the research project - “Data-driven future plasticity manufacturing technologies for affordable super light vehicles”. Qualifications
-
experience at the time of application. Applicants are invited to contact Ms Angie Ku at telephone number 2766 5036 or via email at angie.kk.ku@polyu.edu.hk for further information. Conditions of Service A
-
information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 31 March 2026. Apply Now Posting date: 24 March 2026