78 data "https:" "https:" "https:" "https:" "UNIV" Fellowship positions at Hong Kong Polytechnic University in Hong Kong
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for the Postdoctoral Fellow post should have a PhD degree in Computer Science, Electrical and Computer Engineering or a related discipline or an equivalent qualification and must have no more than five years of post
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and experience. Applicants are invited to contact Prof. Hailong Huang at telephone number 3400 2466 or via email at hailong.huang@polyu.edu.hk for further information. Conditions of Service A highly
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number 2766 5213 or via email at wanghuai.xu@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will
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information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 26 June 2026. Apply Now Posting date: 9 January 2026
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information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will commence on 20 January 2026 until the positions are filled. Apply Now Posting
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degree or an equivalent qualification. Applicants are invited to contact Prof. Huang Xiao at telephone number 2766 7299 or via email at xiao.huang@polyu.edu.hk for further information. Conditions of
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for further information. Conditions of Service For full-time appointment(s), a highly competitive remuneration package will be offered. For part-time appointment(s), the remuneration rate is HK$385 per hour
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@polyu.edu.hk or li-qiao.xia@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 8 April 2026. Apply Now
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application. Applicants are invited to contact Prof. Sheng Chen at telephone number 3400 8619 or via email at sheng.chen@polyu.edu.hk for further information. Conditions of Service A highly competitive
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xiangen.zhao@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 13 January 2026. Apply Now Posting date: 6