12 evolution-"https:"-"https:"-"https:"-"https:"-"O.P" Fellowship research jobs in Hong Kong
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- “Key space technology capability research and development with application to terrain cameras”. Qualifications For the post of Senior Research Fellow, applicants should have a doctoral degree plus at
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- “Development of a flight simulator visual simulation system”. Qualifications Applicants should have a doctoral degree plus at least three years of postdoctoral research experience or equivalent qualifications
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approaches to tackle the global public health threat of hypervirulent and multidrug-resistant Klebsiella pneumoniae” and “Development of bacterial pseudaminic acid-based vaccine to combat infections caused by
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project - “Uncovering the origin and development of space stems in negative electrical discharges through laboratory observations”. Qualifications Applicants should have a doctoral degree or an equivalent
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in the research project - “Development of efficient and cost-effective equipment for angstrom-level precision polishing and its application in processing optical complex surfaces”. Qualifications
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related field. For all posts, applicants should have: (a) experience in algorithm design, programming and system development; (b) good communication and interpersonal skills; and (c) ability
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will assist the project leader in the research project - “Development of Fe-based high-entropy alloys with superior mechanical properties”. Qualifications For the post of Postdoctoral Fellow, applicants
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months] Duties The appointees will assist the project leader in the research project – “Multi-sensor-based smart sorting (MSS) system for solid waste recycling and sustainable development”. Qualifications
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the research project - “Development of a novel dendritic cell-targeted vaccination approach for treating mesothelioma”. Qualifications Applicants should have a doctoral degree or an equivalent qualification and
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months] Duties The appointees will assist the project leader in the research project - “Development of intelligent ultra-precision air-bearing hydrostatic spindle for grinding semiconductor wafer