14 computer-science-programming-languages-"St"-"St" positions at European Magnetism Association EMA in France
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controlled via structural phase transitions or external fields. The successful candidate will develop and apply a range of theoretical and computational methods based on first-principles electronic structure
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SPINTEC fabrication facilities. As such, this thesis will be stationed mostly at SPINTEC in Grenoble, the PhD program being registered at Université Grenoble Alpes. You will also be part of the Vertical
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. • Strong organizational skills, project management capabilities, and team spirit. • Flexibility and proactivity in a startup environment. Education • PhD (preferred) in physics, materials science
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Description of the offer : Spin vertical external cavity surface emitting lasers (spin-VECSELs) reveal unprecedented advantages of spintronics for applications beyond magnetoresistance and have the potential to form a new generation of optical communication systems. Till now, the circular...
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the Spintronics and Component Technology Laboratory (SPINTEC) and micro- and nanomagnetism at the Institut Néel. We expect that the candidate has knowledge and practical experience of micromagnetic simulations
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technology is reducing the write current, which is intrinsically linked to the charge-to-spin current conversion ratio (), a key parameter defining the efficiency of SOT materials. The TopMemo project aims
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schools History News 2025 School Introduction Registration Program Committees Sponsors Contact Repository Lectures by topic Lectures by author Search lectures 2024 2023 2022 2021 2020 2019 2018 2017 2015
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Description of the offer : We have an open position at the Laboratoire Albert Fert in the field of “NV imaging of spin-wave dynamics in magnonics devices”. In recent years, NV based imaging techniques have been demonstrated to enable spin-wave imaging with spatial resolution down to 50 nm with...
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topological textures. A wide range of applied functionalities could be considered: terahertz sources, unconventional computing and AI, security components, telecommunications, sensors, memories etc.