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performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out Wafer-Level Packaging (FOWLP) has received
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National Research Council Canada | National Capital Region Almonte, Ontario | Canada | about 23 hours ago
competitively and must demonstrate the ability to perform original, high-quality research in their chosen field. Research Associates will be offered appointments to the staff of the National Research Council on a
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for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out
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Spintronics, Complex systems, Theoretical Mathematical Science, Big Data, Mechanobiology / Physical Biology, Bio-energy, Genetic to Physiology, Mental Health, High Performance Computation in Physics, Chemistry
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Leong Scholar should not only be a person of high intellect but a well-rounded person of sound character. Renewal of scholarship funding for up to the full four years is conditional upon recipients making