1 modeling-and-simulation PhD positions at Université de Sherbrooke in Canada

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PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

in charge of (i) developing an analytical lumped model for thermal resistance at the package level, (ii) designing and simulating the thermomechanical and fluidic behavior of the vapor chamber, (iii

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