1 fpga-asic-vhdl Fellowship positions in Canada

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Postdoctoral Fellow-Temporary Bonding and Debonding Processes for Fan-Out Wafer-Level Packaging

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 2 months ago

. Topic: We are looking for a well-qualified and highly motivated student to develop new TBD processes for FOWLP to integrate heterogeneous active chips (HBM, ASIC) and passive interconnect/thermal chips

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