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in a high-density fan out wafer level package. Topic: This thesis aims to develop a vapor chamber-based cooling solution for high-power microelectronics. It involves designing a thermomechanical and
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for the evolution of microelectronics, enhancing performance through heterogeneous integration. Traditional methods struggle to meet the demands of high-performance computing, AI, aerospace, and defense. Fan-Out
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potential and demonstrated and potential leadership ability are submitted electronically through ResearchNet by the referee two leadership reference letters ; two PDFs are provided to the applicant, who
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email with a faculty member in the department under whose mentorship you would like to study. This person may be able to support your application in the selection process Apply online and arrange to have
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National Research Council Canada | National Capital Region Almonte, Ontario | Canada | about 21 hours ago
competitively and must demonstrate the ability to perform original, high-quality research in their chosen field. Research Associates will be offered appointments to the staff of the National Research Council on a
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Authorization before travelling. For more information, see: https://safetyabroad.ubc.ca or email safety.abroad@ubc.ca . Eligibility Applicant eligibility: Research discipline eligibility: The Friedman Award