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in developing fully additive manufacturing processes for electronics packaging in Chiplet technology. Subject description Cyber-Physical Systems encompass integrated software, electronics hardware, and
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lab scale, thermodynamic calculations and characterization of materials using various analytical equipment including Thermal analysis, XRD, SEM, LOM, etc. Some parts of the investigations might
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, Internet of Things, Systems-of-Systems automation, Machine Learning, Deep Learning, Data Science, Electronic systems design, and sensor systems. Cyber-Physical Systems (CPS) focuses on integrated software
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, Internet of Things, Systems-of-Systems automation, Machine Learning, Deep Learning, Data Science, Electronic systems design, and sensor systems. Cyber-Physical Systems (CPS) focuses on integrated software
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, Internet of Things, Systems-of-Systems automation, Machine Learning, Deep Learning, Data Science, Electronic systems design, and sensor systems. Cyber-Physical Systems (CPS) focuses on integrated software
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, Internet of Things, Systems-of-Systems automation, Machine Learning, Deep Learning, Data Science, Electronic systems design, and sensor systems. Cyber-Physical Systems (CPS) focuses on integrated software
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experimental work, particularly in material characterization and/or large-scale structural testing. Demonstrated scientific writing ability; prior authorship or co-authorship of peer-reviewed journal
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, and email) Closing date for applications: 12 June 2025 Reference number: 2366-2025 URL to this page https://web103.reachmee.com/ext/I003/583/main?site=6&validator=e4575239eb8c0828707e2b716f86c5f8&lang
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for improving the ability of robots to interact with the surrounding environment and humans during the execution of specific tasks. Project description You will be working in the field of systems and synthetic
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, and email) Closing date for applications: 12 March 2025 Reference number: 885-2025 URL to this pagehttps://web103.reachmee.com/ext/I003/583/main?site=6&validator=e4575239eb8c0828707e2b716f86c5f8&lang=UK