3 postdoc-parallel-computing positions at Université de Sherbrooke

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Postdoctoral Fellow-Temporary Bonding and Debonding Processes for Fan-Out Wafer-Level Packaging

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

Researcher (R1) Positions Postdoc Positions Country Canada Application Deadline 30 May 2025 - 00:00 (America/Toronto) Type of Contract Temporary Job Status Full-time Hours Per Week 37 Offer Starting Date 1 Sep
PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

- 02:00 (America/Toronto) Type of Contract Temporary Job Status Full-time Hours Per Week 37 Offer Starting Date 1 Sep 2025 Is the job funded through the EU Research Framework Programme? Other EU
PhD Offer-Development of molding processes for heterogeneous integration of large electronic chips

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

Research Framework Programme? Other EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Context: Advanced packaging technologies are crucial

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