61 postdoc-in-thermal-network-of-the-physical-building Postdoctoral positions in United Arab Emirates
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Engineering. NYU Abu Dhabi, NYU New York, and NYU Shanghai, form the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six continents
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Description The Division of Engineering and the Center for Interacting Urban Networks (CITIES) at New York University Abu Dhabi are inviting applications for a Post-Doctoral Associate to join the
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the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six continents that enable seamless international mobility of students and faculty in
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of concrete. To develop structural-health-monitoring networks specifically directed toward the oil and gas industry. To develop novel self-healing cementitious materials through chemical and/or bio
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arts and science undergraduate program in the Arts, Sciences, Social Sciences, Humanities, and Engineering. NYU Abu Dhabi, NYU New York, and NYU Shanghai, form the backbone of NYU’s global network
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Post-Doctoral Associate in the Center for Translational Medical Devices (Modeling) - Dr. Rafael Song
the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six continents that enable seamless international mobility of students and faculty in
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Engineering. NYU Abu Dhabi, NYU New York, and NYU Shanghai, form the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six continents
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, Humanities, and Engineering. NYU Abu Dhabi, NYU New York, and NYU Shanghai, form the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six
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, Humanities, and Engineering. NYU Abu Dhabi, NYU New York, and NYU Shanghai, form the backbone of NYU’s global network university, an interconnected network of portal campuses and academic centers across six
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either science (Chemistry, Physics) or Engineering, with prior experience and strong publication record in device fabrication. To be considered, all applicants must submit a cover letter, curriculum vitae