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arrival date of the university central mail service or the time stamp on the email server of TUD applies), preferably via the TUD SecureMail Portal https://securemail.tu-dresden.de by sending it as a
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IX (SGB IX) will receive priority for employment. Please submit your application with the usual documents by June 20, 2025 (stamped arrival date of the University Central Mail Service or the time stamp
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priority for employment. Please submit your application with the usual documents by June 20, 2025 (stamped arrival date of the University Central Mail Service or the time stamp on the TUD email server
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methods for digital circuit design. You'll be responsible for the following tasks: You'll analyze design and layout flows for Complementary Metal Oxide Semiconductor (CMOS) silicon digital circuits. You'll
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: Didactic skills are acquired by the supervision of undergraduate students. Initiative and Responsibility: Programme organisation enables students to contribute actively to the scientific programme by
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interested? Please send us your application with cover letter, curriculum vitae as well as names and contact information of two references summarised in a PDF file (max. 10 MB) by June 15, 2025, quoting
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out within the DFG Priority Programme “DaMic - Data-driven Alloy and Microstructure Design of Sustainable Structural Metals” (SPP 2489), in close collaboration with a research partner responsible for
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ethnography, interviews and participant observation; analyse and interpret data, and triangulate findings with the results of quantitative project components; present results at conferences and co-publish them
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that promotes individual creativity and effective teamwork with a clear focus on quality output. More information about the group is available at www.ep.mgt.tum.de/pur Application Please send a cover
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and effective teamwork with a clear focus on quality output. More information about the group is available at www.ep.mgt.tum.de/pur Application Please send a cover letter that explains how this position