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PhD Studentship: Rolls-Royce Sponsored PhD Scholarship – Micromechanics and In-Depth Materials Analysis of Advanced Aerospace Materials Upon the Manufacturing Process Engineering Applications
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resolution. This process offers strong potential for applications in clean energy, electronics, and other advanced technologies. The PhD will focus on extending this technology to high-melting-point metals and
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resolution. This process offers strong potential for applications in clean energy, electronics, and other advanced technologies. The PhD will focus on extending this technology to high-melting-point metals and
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engineering, physics, or a closely related discipline. Candidates with a strong 2:1 degree may also be considered, as well as applicants with equivalent overseas qualifications. Applications should be submitted
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validate new capabilities within XCALibre.jl, Nottingham’s GPU-accelerated, AI-ready CFD framework, turning complex coupled physics into practical tools that engineers can use in real manufacturing workflows
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validate new capabilities within XCALibre.jl, Nottingham’s GPU-accelerated, AI-ready CFD framework, turning complex coupled physics into practical tools that engineers can use in real manufacturing workflows
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Supervisors: Prof Ioan Notingher (School of Physics and Astronomy) Dr George Gordon and Dr Abdelkhalick Mohammad (Faculty of Engineering) Funding: fully-funded (stipend and PhD fees) Start date
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to the interests of one of the School’s research groups: Cyber-physical Health and Assistive Robotics Technologies Computational Optimisation and Learning Lab Computer Vision Lab Cyber Security Functional
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note that, due to funding restrictions, this studentship is only available to UK (home fees) citizens. Application Process Informal enquiries may be addressed to: Dr Stephen Ambrose – Stephen.Ambrose3
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of approximately £20,780. After a suitable candidate is found, funding is then sought from the University of Nottingham as part of a competitive process Interested applicants can find out more by contacting me via