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wafer conducive to the microfabrication and integration processes of the microelectronics industry. Despite its strong potential and high level of maturity, FOWLP is still very rarely used
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reduction, temporary bonding & debonding technology (TBD) has been further developed to address new process challenges. In this regard, temporary carrier technology transcends its traditional function
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compatible with high-density FOWLP process flow. Work Supervision: As part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing, this PhD thesis will be
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