2 parallel-processing PhD scholarships at Université de Sherbrooke in Canada

PhD Offer-Development of molding processes for heterogeneous integration of large electronic chips

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

wafer conducive to the microfabrication and integration processes of the microelectronics industry. Despite its strong potential and high level of maturity, FOWLP is still very rarely used

PHD offer- Design, Fabrication and Characterization of Embedded Vapor Chamber Cooling for High-Density Fan-Out Wafer Level Packages (FOWLP)

Université de Sherbrooke | Sherbrooke East, Quebec | Canada | 3 months ago

compatible with high-density FOWLP process flow. Work Supervision: As part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing, this PhD thesis will be