32 parallel-processing-bioinformatics Postdoctoral positions at Stony Brook University
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Computer Engineering, Applied Mathematics or a related field in hand by the start of the appointment. The new AI Innovation Institute at Stony Brook University invites applicants for Postdoctoral Scholars
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trainings’ on essential skills such as grant and manuscript writing, mentoring, pedagogy, and scientific presentations as well as coaching through the job search process Development of teaching skills through
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subduction processes. A key aspect of the research involves utilizing seismically constrained crustal rheology and structure to inform and validate our models. The incumbent will need excellent oral and
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subduction processes. A key aspect of the research involves utilizing seismically constrained crustal rheology and structure to inform and validate our models. The incumbent will need excellent oral and
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) Doctoral Degree (or foreign equivalent) in Computer Sciences, Engineering, Neuroscience, Psychology or a closely
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Liu in the department of Electrical and Computer Engineering . The incumbent will conduct research and ensure that all experiments are appropriately conducted following the policies and procedures
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Associate will assist a Principal Investigator Leon Shterengas in the Department of Electrical and Computer Engineering . The incumbent will conduct research on semiconductor photonic device nanofabrication
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Associate will assist a Principal Investigator Leon Shterengas in the Department of Electrical and Computer Engineering . The incumbent will conduct research on semiconductor photonic device nanofabrication
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training on specific specialized skills and research methods, and is responsible for the operation of the lab. ● Other duties as assigned. Special Notes: The Research Foundation of SUNY is a private
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Computer Engineering or a closely related field, completed by the start date of the appointment. Research experience in at least one of the following areas: ● Chip design, tape-out, and testing