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of providing thinned wafer handling solutions: it becomes a key element in enabling functional diversification through heterogenous integration in the FOWLP concept. The core of the temporary carrier support
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compatible with high-density FOWLP process flow. Work Supervision: As part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing, this PhD thesis will be
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of Pr. Dominique Drouin and Pr. Serge Ecoffey, as part of the IBM/NSERC Alliance Project on Multi-Chip Heterogeneous Integration for High Performance Computing. The work will be done mainly
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