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at Harvard University. The project focuses on microelectronics and soft materials. The position is available beginning in September 2024. The initial appointment will be for one year with a possibility for
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Posting Details Position Details Title Postdoctoral Fellow (Radiation Effects in Microelectronics) Appointment Status Non-Tenure Track Department IU Bloomington Intelligent Systems Engineering
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Details Title Postdoctoral Fellow in Materials Science & Mechanical Engineering - Microelectronics and Soft Materials School Harvard John A. Paulson School of Engineering and Applied Sciences
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in microelectronics and advanced packaging. The Postdoc will be part of a larger team of engineers-scientists working on cutting edge advancements in heterogeneous integration. Responsibilities Develop
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to 100 GHz, using custom and commercial test fixtures. Develop and simulate computational models of material-loaded microelectronic devices to quantify electric, acoustic, and piezoelectric fields for a
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Fellowship position at The University of Texas at Austin is to advance research in microelectronics thermal management and advanced packaging. Aiming to develop early-career researchers by engaging them in
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substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics applications. Ability to work independently and as part of
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microelectronics / materials science / electronic materials as well as experience in applying AI / machine learning techniques (both data and image-based) on interesting use cases as well as strong programming