26 machine-learning-and-image-processing Fellowship positions at Hong Kong Polytechnic University
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research using methods such as sensing technique, 3D printing, human-computer interaction, simulation, and/or machine learning to address challenges in machinery motion planning and construction safety
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) strong background in quantitative methods, statistics, computer science, geospatial data analysis and modeling; (b) experience in AI and geospatial computer version; (c) advanced skills in scientific
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- “The structural evolution of the Chinese aviation network during and after the pandemic: a machine learning-based approach”. He/she will be required to: (a) conduct high-quality research in the field
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) and common data formats (e.g. RVT and DWG). Preference will be given to those with experience in computer graphics, 3D geometric algorithms or WebGL development. Applicants are invited to contact Prof
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experience at the time of application; (b) have experience in InSAR applications for landslides and reclamations, PolSAR/PolInSAR for vegetation mapping, finite element analysis, numerical simulation, machine
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The appointees will assist the project leader in the research project - “Research centre for non-invasive brain computer interface”. Qualifications For the post of Postdoctoral Fellow, applicants should have a
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implementation; b) monitor the project implementation details; c) develop control algorithms and digital twin models; d) guide prototype development and laboratory testing; e) analyse test data and
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will assist the project leader in the research project - “AI-based fashion video generation system”. They will be required to: (a) take part in design and carry out artificial intelligence, machine
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prototype development and laboratory testing; (e) analyse test data and iterate designs; (f) publish top-tier academic papers; and (g) perform any other duties as assigned by the project leader
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of the above-mentioned disciplines. For both posts, applicants should have research experience in either in vivo/in vitro animal studies, Bio-FET, nanomaterials, medical imaging or AI. Preference will be given